职位类型：全职
行业类型：
工作内容： 1. Package/PCB Model extraction by EM tooling. 2. Whole system level signal/power integrity modeling, characterization and simulations including PCB, package and chip IOs. 3. Silicon chip results correlation with simulation 4. Co-simulation flow development 5. Co-work with IC designer to define specification and solve the silicon related signal and power integrity problems in the system. 6. Provide PKG/PCB layout guideline 其它要求： 1.Strong fundamentals of transmission lines, RF, EM and microwave theory 2.Experience with SERDES characterizations and channel equalizations, such as PCI-E, XAUI, 10GKR, USB, MIPI, HDMI, SATA, SAS 56Gbps-PAM4. 3.Experience with memory characterizations and channel equalizations, such as DDR3/4, LPDDR3/4 and HBM. 4.Experience with VNA and TDR measurements for channel characterizations 5.Experience in using simulations tools such as HSPICE, ANSYS HFSS, SIwave, Q3D, Redhawk, Cadence Sigrity and Keysight ADS. 6.Experience in package substrate layout, PCB board level layout